Metallized Precision Ceramic Components | Hermetic Ceramic-to-Metal Sealing Solutions
High-precision metallized ceramic components for hermetic sealing and ceramic-to-metal bonding. Ideal for electronics, semiconductor, and high-reliability applications.
metallized ceramic components
ceramic to metal sealing
hermetic ceramic parts
metallized alumina ceramics
ceramic brazing components
precision ceramic packages
Product Overview
Metallized precision ceramic components are engineered for reliable ceramic-to-metal joining in high-performance applications. Through metallization processes (such as Mo-Mn, W, or thin-film metallization), a metal layer is applied to the ceramic surface, enabling strong bonding via brazing or soldering.
These components are widely used in hermetic sealing systems where mechanical strength, electrical insulation, and airtight performance are critical.
Key Features
1. Reliable Ceramic-to-Metal Bonding
Enables strong and durable joints.
2. Hermetic Sealing Capability
Ensures airtight and leak-proof performance.
3. High Electrical Insulation
Maintains dielectric properties of ceramics.
4. Excellent Mechanical Strength
Suitable for demanding environments.
5. High Precision Manufacturing
Tight tolerances for critical applications.
Typical Products
Metallized ceramic rings
Ceramic packages (DIP, QFN, etc.)
Feedthrough insulators
Ceramic-to-metal sealing components
Custom precision ceramic assemblies
Applications
Semiconductor packaging
Electronic and RF devices
Vacuum and high-reliability systems
Aerospace and defense components
Power electronics and sensors
Technical Advantages
Strong bonding between ceramic and metal parts
Excellent hermeticity for vacuum or sealed systems
Stable performance under thermal cycling
Suitable for high-reliability environments
Manufacturing Capability
High-purity ceramic processing (e.g., alumina, AlN, ZrO₂)
Metallization methods: Mo-Mn, W, thin film
High-temperature sintering and firing
Brazing and sealing technology
Leak testing and quality inspection
Customization Options
Ceramic material selection
Metallization pattern and thickness
Geometry and dimensional tolerances
Assembly and brazing solutions
OEM manufacturing based on drawings
Localized Title (US)
Metallized Ceramic Components for Hermetic Sealing | Precision Ceramic-to-Metal Parts in USA
Localized Content Snippet
We supply high-quality metallized ceramic components across the United States for hermetic sealing and precision electronic applications. Our products ensure reliability and performance.
OEM customization and bulk supply available.
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tem | Unit | ||||
A-95 | A-75 | MS-1 | |||
Bulk Density | ambient temperatures | g/cm³ | ≥3.64 | ≥3.2 | ≥2.7 |
Helium Leak Rate(Tightness) | pa.m3/s | ≤1×10 ^-11 | —— | —— | |
Flexural Strength | ambient temperatures | Mpa | 336.1 | 280 | 160 |
Average Linear Expansion Coefficient | （20~500）℃ | 1/℃ | 7.27×10^-6 | 6.21×10^-6 | 8.48×10^-6 |
（20~800）℃ | 7.73×10^-6 | —— | —— | ||
Dielectric Constant | Mhz20℃ | 9.4 | 8.7 | 7.5 | |
Volume Resistivity | 100℃ | Ω.cm | 5.2×10^15 | 4.5×10^13 | 3.7×10^13 |
300℃ | 5.6×10^14 | —— | —— | ||
500℃ | 4.8×10^13 | —— | —— | ||
Dielectric Loss | 20℃ | 2.4×10^-4 | ≤10×10^-4 | ≤8×10^-4 | |
DC Breakdown Strength | KV/mm | 42.0 | 34 | 28 | |
Thermal Stability | ambient temperatures~800℃ | pass | —— | —— | |
Chemical Stability | 10%HCI | Mg | 4.657 | —— | —— |
1:9NaOH | 0.075 | —— | —— | ||
Area | Gauge length | Maximum load | Maximum stress | |
Unit | mm2 | mm | kN | MPa |
1 | 122.0000 | 100.0000 | 13.1016 | 107.390 |
2 | 122.0000 | 100.0000 | 16.9062 | 138.576 |
3 | 122.0000 | 100.0000 | 13.1273 | 107.601 |
4 | 122.0000 | 100.0000 | 14.4523 | 118.462 |
5 | 122.0000 | 100.0000 | 12.2820 | 100.672 |
6 | 122.0000 | 100.0000 | 13.2656 | 108.735 |
7 | 122.0000 | 100.0000 | 13.8773 | 113.749 |
8 | 122.0000 | 100.0000 | 17.4781 | 143.263 |
Average value | 14.3113 | 117.306 |
