cover ring/Aluminum Nitride Cover Ring | High Thermal Conductivity AlN Compression Ring for Semicond
cover ring/Aluminum Nitride Cover Ring | High Thermal Conductivity AlN Compression Ring for Semicond
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Aluminum Nitride Cover Ring | High Thermal Conductivity AlN Compression Ring for Semiconductor Equipment
Customization:
Available
Terms of Payment:
LC, T/T
OEM/ODM:
available
Sample:Chargeable supportGet samples
Product details
FAQ
Essential details
Lead time:1 month
Shipping:Express delivery
Specification Number:SN0010048
Product Introduction

Aluminum Nitride Cover Ring | High Thermal Conductivity AlN Compression Ring for Semiconductor Equipment


Aluminum nitride (AlN) cover rings with high thermal conductivity and electrical insulation. Ideal for semiconductor equipment, plasma systems, and high-temperature environments.


  • aluminum nitride cover ring

  • AlN compression ring

  • ceramic cover ring semiconductor

  • high thermal conductivity ceramic ring

  • insulating ceramic ring AlN

  • plasma equipment ceramic ring


Product Overview

The aluminum nitride (AlN) cover ring, also known as a compression ring, is a high-performance ceramic component designed for semiconductor and plasma processing equipment. With excellent thermal conductivity and electrical insulation, AlN rings are widely used to protect, position, and stabilize components in high-temperature and cleanroom environments.


Key Features

1. High Thermal Conductivity
Efficient heat dissipation helps maintain thermal stability in semiconductor processes.

2. Excellent Electrical Insulation
Ensures safe operation in electrically sensitive environments.

3. High Temperature Resistance
Suitable for plasma and high-temperature processing conditions.

4. Dimensional Stability
Maintains shape and precision under thermal cycling.

5. Low Particle Generation
Ideal for cleanroom and contamination-sensitive applications.


Applications

  • Semiconductor processing equipment

  • Plasma etching and deposition systems

  • Wafer handling and chamber components

  • Vacuum and high-temperature systems

  • Precision industrial equipment


Technical Advantages

  • Improved thermal management in equipment

  • Reduced contamination risk in cleanroom environments

  • Long service life under harsh operating conditions

  • Compatible with advanced semiconductor processes


Customization Options

  • Outer and inner diameter

  • Thickness and profile design

  • Flatness and surface finishing

  • Slot, hole, or special feature machining

  • OEM production based on drawings


Localized Title (US)

Aluminum Nitride Cover Rings for Semiconductor Equipment | High Thermal Conductivity Ceramic Supplier in USA

Localized Content Snippet

We supply high-performance aluminum nitride cover rings to customers across the United States for semiconductor and plasma processing applications. Our AlN rings provide excellent thermal management, electrical insulation, and durability in demanding environments.

OEM customization and engineering support available.


🔹 CTA

  • Request a Custom AlN Ring Quote

  • Submit Your Technical Drawings

  • Contact Our Engineering Team


Material Characteristics


CategoryGrade AlN-HT170AlN-S170
Chemical CompositionAlN%%≥99.5≥99.5
Chemical structure
Production Process Hot PressingAtmosphere Sintering
Production Process
Densityg/cm3≥3.26g/cm3≥3.3g/cm3
Density
Thermal conductivity (room temperature)W/m.k≥170≥170
Thermal conductivity at 20℃
Surface Roughnessum≤ 2≤ 2
Surfaceness
Leeb hardnessHL800750
Hardness
Flexural strengthMpa≥350≥350
Flexural Strength

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