Aluminum Nitride Cover Ring | High Thermal Conductivity AlN Compression Ring for Semiconductor Equipment
Aluminum nitride (AlN) cover rings with high thermal conductivity and electrical insulation. Ideal for semiconductor equipment, plasma systems, and high-temperature environments.
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Product Overview
The aluminum nitride (AlN) cover ring, also known as a compression ring, is a high-performance ceramic component designed for semiconductor and plasma processing equipment. With excellent thermal conductivity and electrical insulation, AlN rings are widely used to protect, position, and stabilize components in high-temperature and cleanroom environments.
Key Features
1. High Thermal Conductivity
Efficient heat dissipation helps maintain thermal stability in semiconductor processes.
2. Excellent Electrical Insulation
Ensures safe operation in electrically sensitive environments.
3. High Temperature Resistance
Suitable for plasma and high-temperature processing conditions.
4. Dimensional Stability
Maintains shape and precision under thermal cycling.
5. Low Particle Generation
Ideal for cleanroom and contamination-sensitive applications.
Applications
Semiconductor processing equipment
Plasma etching and deposition systems
Wafer handling and chamber components
Vacuum and high-temperature systems
Precision industrial equipment
Technical Advantages
Improved thermal management in equipment
Reduced contamination risk in cleanroom environments
Long service life under harsh operating conditions
Compatible with advanced semiconductor processes
Customization Options
Outer and inner diameter
Thickness and profile design
Flatness and surface finishing
Slot, hole, or special feature machining
OEM production based on drawings
Localized Title (US)
Aluminum Nitride Cover Rings for Semiconductor Equipment | High Thermal Conductivity Ceramic Supplier in USA
Localized Content Snippet
We supply high-performance aluminum nitride cover rings to customers across the United States for semiconductor and plasma processing applications. Our AlN rings provide excellent thermal management, electrical insulation, and durability in demanding environments.
OEM customization and engineering support available.
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| CategoryGrade | AlN-HT170 | AlN-S170 | |
| Chemical CompositionAlN% | % | ≥99.5 | ≥99.5 |
| Chemical structure | |||
| Production Process | Hot Pressing | Atmosphere Sintering | |
| Production Process | |||
| Density | g/cm3 | ≥3.26g/cm3 | ≥3.3g/cm3 |
| Density | |||
| Thermal conductivity (room temperature) | W/m.k | ≥170 | ≥170 |
| Thermal conductivity at 20℃ | |||
| Surface Roughness | um | ≤ 2 | ≤ 2 |
| Surfaceness | |||
| Leeb hardness | HL | 800 | 750 |
| Hardness | |||
| Flexural strength | Mpa | ≥350 | ≥350 |
| Flexural Strength |
