Ultra-Thin Large Aluminum Nitride Ceramic Ring | High Thermal Conductivity AlN Ring
Ultra-thin large aluminum nitride (AlN) ceramic rings with high thermal conductivity and dimensional stability. Ideal for semiconductor, electronics, and precision equipment applications.
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Product Overview
Ultra-thin large aluminum nitride (AlN) ceramic rings are high-performance structural components designed for applications requiring excellent thermal conductivity and dimensional stability. With advanced processing capabilities, these rings can achieve large diameters and ultra-thin profiles, making them ideal for semiconductor, electronics, and high-precision equipment.
Key Features
1. High Thermal Conductivity
Aluminum nitride provides excellent heat dissipation, ideal for thermal management applications.
2. Ultra-Thin & Large Size Capability
Supports challenging designs with large diameters and minimal thickness.
3. Excellent Electrical Insulation
Suitable for electronic and semiconductor environments.
4. High Dimensional Stability
Maintains flatness and precision under thermal stress.
5. Low Thermal Expansion
Reduces deformation in temperature-sensitive applications.
Applications
Semiconductor equipment components
Heat dissipation structures
Electronic packaging systems
Vacuum and plasma equipment
Precision industrial assemblies
Technical Advantages
Efficient heat transfer and thermal management
High flatness and tight tolerances
Stable performance in high-temperature environments
Suitable for cleanroom and high-tech applications
Customization Options
Outer diameter and inner diameter
Thickness (ultra-thin processing capability)
Flatness and parallelism control
Surface finishing and polishing
OEM production based on drawings
Localized Title (US)
Ultra-Thin Large Aluminum Nitride Ceramic Rings | High Thermal Conductivity Components Supplier in USA
Localized Content Snippet
We supply ultra-thin large aluminum nitride ceramic rings to customers across the United States. Our AlN components provide excellent heat dissipation, dimensional stability, and precision for semiconductor and electronic applications.
OEM customization and engineering support available.
🔹 CTA
Request a Custom AlN Ring Quote
Submit Your Technical Drawings
Contact Our Engineering Team
Material Characteristcs
| CategoryGrade | AlN-HT170 | AlN-S170 | |
| Chemical compositionAlN% | % | ≥99.5 | ≥99.5 |
| Chemical structure | |||
| Production process | Hot Pressing | Atmosphere Sintering | |
| Production Process | |||
| Density | g/cm3 | ≥3.26g/cm3 | ≥3.3g/cm3 |
| Density | |||
| Thermal conductivity (room temperature) | W/m.k | ≥170 | ≥170 |
| Thermal conductivity at 20℃ | |||
| Surface roughness | um | ≤ 2 | ≤ 2 |
| Surfaceness | |||
| Leeb Hardness | HL | 800 | 750 |
| Hardness | |||
| Bending strength | Mpa | ≥350 | ≥350 |
| Flexural Strength |
