Precision ceramic components mainly refer to high-precision, complex structural ceramic parts used in semiconductor equipment. These precision ceramic components are key parts of semiconductor equipment, and their R&D and production directly affect the development of the semiconductor industry. In recent years, with adjustments in national policies, the semiconductor industry has developed rapidly, and its scale has grown significantly. As semiconductor manufacturing equipment continues to evolve towards greater precision and complexity, the technical requirements for high-precision ceramic key components are also increasing. Due to the advantages of ceramics—high hardness, high elastic modulus, high wear resistance, high insulation, corrosion resistance, and low thermal expansion—they can be used as components in wafer polishers, epitaxial/oxidation/diffusion heat treatment equipment, lithography machines, deposition equipment, semiconductor etching equipment, and ion implanters. Semiconductor ceramics include alumina, silicon nitride, aluminum nitride, and silicon carbide. In semiconductor equipment, precision ceramics account for approximately 16% of the total value.

(Image source: pexels)

It is understood that a large number of oxide ceramic precision components are used in semiconductor equipment. For example, high-purity Al₂O₃ coatings or Al₂O₃ ceramics are used as protective materials for etching chambers and internal components. In addition to chambers, gas nozzles, gas distribution plates, and retaining rings for securing wafers in plasma equipment also require alumina ceramics. In wafer polishing processes, alumina ceramics are widely used in polishing plates, polishing pad conditioning platforms, and vacuum chucks.

(Alumina polishing plate, source: Kyocera, Japan)

Furthermore, as we mentioned above, zirconia ceramics are the primary material for manufacturing bonding capillaries, which are essential tools in wire bonding processes.

Silicon carbide materials have an extremely high elastic modulus, thermal conductivity, and a low coefficient of thermal expansion. They are not prone to bending stress deformation or thermal strain and have excellent polishability, allowing them to be machined into superior mirror surfaces. Therefore, using silicon carbide as a material for precision structural components in key semiconductor equipment such as lithography machines offers significant advantages.

(Silicon carbide fine-motion stage assembly)

As a covalent bond compound, silicon nitride has a low coefficient of thermal expansion, high thermal conductivity, excellent chemical corrosion resistance, and outstanding thermal shock resistance. Hot-pressed sintered Si₃N₄ has extremely high hardness and excellent high-temperature resistance. Its strength remains undiminished at high temperatures up to 1200°C, and it does not melt when heated, only decomposing at 1900°C. Therefore, silicon nitride ceramics are considered the "ceramic material with the best overall performance" and are used to manufacture platforms, guide rails, bearings, and other components in semiconductor equipment.

(Image source: Haituo Innovation)

Current electrostatic chucks mainly use alumina ceramics as the primary material. However, the thermal conductivity and related mechanical properties of alumina are inferior to those of aluminum nitride ceramics. Therefore, using aluminum nitride ceramics instead of alumina ceramics as the manufacturing material for electrostatic chucks is a future trend.

In high-end lithography machines, to achieve high processing precision, it is necessary to widely use ceramic components with good functional composite properties, structural stability, thermal stability, and dimensional accuracy. These include E-chucks, vacuum chucks, blocks, water-cooled plates for magnetic steel frames, reflectors, and guide rails. These key components are typically made of ceramic materials.

(Water-cooled frame for scanning motor)

(Rectangular mirror for lithography machine)

In etching equipment, components made from ceramic materials primarily include viewports, gas distribution plates, nozzles, insulating rings, cover plates, focus rings, and electrostatic chucks. As chip feature sizes decrease and halogen-based plasma energy gradually increases, the plasma etching resistance of etching process chambers and internal components becomes increasingly important. Compared to organic and metal materials, ceramic materials generally have better physical and chemical corrosion resistance and can operate at higher temperatures. Therefore, in the semiconductor industry, various ceramic materials have become the material of choice for manufacturing core components in equipment for semiconductor single-crystal silicon wafer production and front-end processing steps.

(Image source: Kyocera, Japan)

(Silicon carbide ring manufactured by Maruwa, Japan)

(Electrostatic chuck, image source: Haituo Innovation)

Another example is the ceramic bonding capillary, an essential tool in the wire bonding process. The main component of some manufacturers' ceramic bonding capillaries is zirconia-reinforced alumina. Their microstructure is uniform and dense, with a density increased to 4.3 g/cm³. The content of tetragonal zirconia and the uniform, dense microstructure give zirconia-doped ceramic bonding capillaries exceptionally good mechanical properties, reducing tip wear and replacement frequency during the wire bonding process.

(Ceramic bonding capillary, source: Sanhuan Group)

A semiconductor device may appear to be made of metal and plastic, but it actually contains many precision ceramic components with advanced technology. In summary, precision ceramics are used in semiconductor equipment far more extensively than we might imagine.

Due to their excellent properties, precision ceramics are widely used in national defense, chemical engineering, metallurgy, electronics, machinery, aviation, aerospace, and biomedicine, among other fields. They have become key materials for development in these sectors and have attracted significant attention from industrially developed countries. Their development greatly influences the progress and advancement of other industries.

Currently, there is a clear trend of rapid technological progress, expanding application fields, and steady market growth in the global precision ceramics industry. Due to high technical barriers, the precision ceramics industry has long been dominated by Japan, the United States, and some European companies with unique technologies. Among these, Japan is the largest producer of precision ceramics, with a comprehensive product range, high output, broad application fields, and superior overall performance, holding a dominant position in the ceramics market, especially the electronic ceramics market. High-temperature structural ceramics are a key focus of precision ceramics development in the United States. Additionally, EU countries, particularly Germany and France, have conducted focused research in the field of structural ceramics, primarily concentrating on power generation equipment, new energy materials, and ceramic components for engines.

China has conducted research and development on almost all industrial precision ceramic materials. Through R&D projects such as the "Sixth Five-Year Plan," "Seventh Five-Year Plan," "Eighth Five-Year Plan," "863 Program," "973 Program," "Science and Technology Support Program," and "Major National Science and Technology Projects," China's research and development capabilities for precision ceramic materials have significantly improved.

The main methods for preparing ceramic powders in China include solid-state reaction, liquid-phase reaction, and gas-phase reaction. With the development of nanotechnology, powders produced by gas-phase reactions have characteristics such as large surface area, high sphericity, and narrow particle size distribution, providing a foundational basis for high-performance ceramic preparation.

The main forming technologies used in China's precision ceramics industry include cold isostatic pressing (a type of dry pressing), injection molding (a type of plastic forming), tape casting (a type of slurry forming), and gel casting.

China's precision ceramics industry primarily uses hot press sintering (HP) and gas pressure sintering (GPS) technologies. China has broken foreign technological blockades in large-size gas pressure sintered silicon nitride ceramics and achieved technological localization.

Machining technologies such as electrical discharge machining (EDM), ultrasonic machining, laser machining, and chemical machining are gradually being applied to ceramic processing.

Compared to the overseas precision ceramics industry, most of the precision ceramic products manufactured in China have low added value. Many ceramic components with high technical content in electronic end-products still need to be imported in large quantities. Issues such as raw material purification, high-density components, large sizes, complex shapes, and ceramic targets urgently need to be addressed. The performance indicators of some domestic materials have not yet reached the level of similar foreign materials, equipment precision is poor, and high-end equipment relies on imports. The integration of industry, academia, research, and application is not sufficiently close, and laboratory achievements receive inadequate attention, leading to a serious disconnect from practical applications.

Currently, China's manufacturing technology and processes for high-purity, ultra-fine, high-performance ceramic powders still lag significantly behind countries like Japan and the United States, with high-end powder materials continuing to be primarily imported. Additionally, there is a considerable gap in efficient powder dispersion technology. Introducing high-end equipment has improved our technological equipment level to some extent, but it involves significant investment and financial pressure for enterprises. With the development of domestic high-end preparation equipment, the demand for ceramic materials and components that meet specific material performance requirements is increasing. However, due to limitations in China's high-end ceramic material manufacturing level, imported materials are still largely necessary. Overall, China's transition from a major to a strong country in advanced ceramics mainly faces the following problems:

China relies heavily on imports for these two important advanced ceramic powder raw materials, mainly from Japanese companies like UBE and Tokuyama Soda. These materials are not only expensive but also have uncertain supply reliability. Domestic manufacturers have considerable gaps in powder performance, batch production stability, and consistency. This hinders the industrialization of many high-value-added ceramic products, such as high-end ceramic bearing balls and high-thermal-conductivity, high-strength ceramic substrates.

With the rapid development of new energy vehicles, high-speed rail, wind power, and 5G base stations, there is enormous demand for next-generation high-thermal-conductivity, high-strength silicon nitride ceramic substrates used in IGBTs (high-power devices for these new industries). The annual demand from the CRRC Group alone reaches 5 million units. Companies such as Kyocera (Japan) and Rogers Corporation (USA) can already mass-produce and supply copper-clad etched silicon nitride ceramic substrates. China started later in this field, but in recent years, university research institutions and some enterprises have accelerated R&D, achieving significant progress, with thermal conductivity exceeding 90 W/m·K, flexural strength exceeding 650 MPa, and fracture toughness exceeding 6.5 MPa·m¹/². However, there is still a gap before industrialization.

High-thermal-conductivity, high-strength silicon nitride ceramic substrate

Copper-clad substrates with high thermal conductivity based on aluminum nitride or silicon nitride for IGBTs are still primarily imported, especially for high-power device control modules in high-speed rail. Domestic substrate copper-cladding technology has not yet fully met the strict requirements for copper-clad plates, for example, in terms of thermal cycle resistance. Currently, the international community has adopted advanced active metal bonding (AMB) technology for copper cladding, which provides higher bonding strength and better resistance to thermal cycling compared to direct copper bonding (DBC).

For many high-end alumina ceramic products, such as alumina-based bioceramics, ceramic substrates, vacuum tubes, wear-resistant textile ceramics, and electronic vacuum ceramics, the alumina powder still relies on imports from Japan, Germany, and the United States. This is particularly true for producing alumina ceramic components with 99.5%, 99.7%, 99.8%, and 99.9% alumina content, characterized by fine grains, uniform structure, good electromechanical properties, and wear resistance. Domestic manufacturers have gaps in controlling impurity content in alumina powder, sintering activity, and especially in the microstructure uniformity and material properties after sintering.

Alumina ceramic planar capacitive pressure sensors are used in massive quantities across various automobiles, representing a market worth nearly 100 billion RMB. However, these alumina plates are currently mainly imported. Domestic alumina plates have gaps in elastic modulus, elastic deformation cycle count, service life, and reliability, and have not yet entered commercial practical application.

Planar zirconia oxygen sensors play a significant role in reducing harmful emissions from automobile exhaust and improving fuel economy. Currently, the mainstream automotive oxygen sensors are concentration cell type zirconia sensors. In recent years, the number of cars held in China has been increasing, and each car needs at least two oxygen sensors. The oxygen sensor market is growing at an annual rate of 30%, and oxygen sensors are consumable parts that typically need replacement at every major service interval (or even annually). Currently, almost all automotive oxygen sensors in China are either entirely imported or assembled from imported components. The enormous automotive oxygen sensor market, strict automotive emission regulations, and China's lack of relevant technology make it particularly urgent and important to research and develop oxygen sensor products with good performance, high reliability, and our own intellectual property. Major manufacturers of automotive oxygen sensors include Bosch, Delphi, Denso, NTK, and Kefico, along with their joint ventures and subsidiaries in various regions. Bosch is the largest oxygen sensor manufacturer. Additionally, some foreign ceramic companies, relying on their strong ceramic development capabilities, produce oxygen sensor sensing elements and ceramic heaters, such as Kyocera.

The market demand for bioceramic hip joints is enormous, with an average of one ceramic hip joint replacement surgery occurring every two minutes worldwide. Currently, these are mainly produced by companies such as CeramTec (Germany) and Kyocera (Japan), and China needs to import large quantities each year. The material performance and reliability requirements for ceramic hip joints are extremely high, with a service life of at least 20 years. The material produced by CeramTec, a ZrO₂ and SrAl₁₂₋ₓCrₓO₁₉ platelet grain synergistically reinforced and toughened Al₂O₃-based composite ceramic, has achieved flexural strength and fracture toughness of 1380 MPa and 6.5 MPa·m¹/², respectively. China has no equivalent product in this area.

Ceramic bearings used in high-end equipment such as aerospace engines, wind power generators, and CNC machine tools require not only high mechanical and thermal properties but also excellent wear resistance, reliability, and long life. There is still a significant gap between domestic silicon nitride ceramic bearing balls and those manufactured by Toshiba Ceramics (Japan). Compared to internationally renowned bearing companies such as SKF (Sweden), FAG (Germany), and KOYO (Japan), China's bearings are still in the mid-to-low range of the industrial chain. High-end products used in wind power and CNC machine tools still rely on imports.

For transparent and infrared-transmitting ceramic materials used in defense and military applications, such as Y₂O₃, MgO, AlON, MgAl₂O₄, and Nd:YAG (laser) transparent ceramics. Currently, our technology is limited to producing relatively small sizes. We face challenges in producing large-size (up to 0.5 meters internationally) transparent and wave-transmitting ceramic materials, with gaps in both processing technology and equipment.

Semiconductor wafer production lines require numerous ceramic spare parts, such as ceramic plates, ceramic arms, ceramic rings, and retainers. These involve various structural ceramic materials including alumina, aluminum nitride, and silicon carbide. These parts require high material purity, uniform density, extremely high processing precision, and surface finish. Only a few domestic enterprises provide some of these products, and high-end aluminum nitride and silicon carbide spare parts still rely on imports.

It is recommended that relevant state authorities further increase support for precision ceramic component R&D and industry development in the implementation of the "National Integrated Circuit Industry Development Promotion Outline." By integrating research systems, industry associations, and alliances, priority should be given to concentrating resources nationwide to select and support a batch of potential enterprises with international competitiveness, thereby driving the development of the entire industry.

It is recommended that relevant state authorities encourage large state-owned enterprises in equipment, materials, chemicals, and other sectors to participate in the development of the precision ceramics industry. Establish guidance targets for the localization of equipment and components, create a localization guidance mechanism for key components/materials that combines fiscal guidance with technology insurance, and encourage domestic semiconductor equipment companies to purchase domestic precision ceramic components through the support of government finance and market-oriented insurance products. Encourage enterprises and universities to jointly establish technology R&D and testing/certification institutions, accelerating the establishment of a technology service system for the localization of key components and materials like precision ceramics.

It is recommended that relevant state authorities establish intellectual property assistance centers in precision ceramics industry clusters. Guide and assist enterprises in handling intellectual property disputes by shortening the IP review and authorization cycle and increasing penalties for infringement, thus protecting R&D innovation momentum. Attract key precision ceramics enterprises to settle in bonded areas, and leverage differentiated tax policies in specific zones to alleviate current R&D and development cost pressures in the semiconductor industry. Simultaneously, strengthen policy coordination and integration for the cultivation of specialized technical talent for precision ceramics enterprises, supporting local authorities in providing support services for core team members in areas such as household registration, children's education, and healthcare, especially service support for talent teams recruited from leading foreign companies.

It is recommended to further improve the trading functions of the Shanghai and Shenzhen Stock Exchanges, and take the establishment of the Beijing Stock Exchange as a new opportunity to create new materials sectors dedicated to precision ceramics and other advanced materials within the three national-level exchanges, precisely supporting small and medium-sized enterprises with core competitiveness in new materials. Encourage long-term funds such as insurance and trusts to increase equity investments in outstanding unlisted small and medium-sized enterprises, establishing reasonable channels for capital influx and exit, clearing obstacles and accelerating the growth of "core technology" enterprises in the new materials sector.

Additionally, it is worth noting that the Fifth Advanced Ceramics in Semiconductor Applications and Industry Development Forum will be grandly held on June 11, 2026, at the Pullman Suzhou Zhonghui Hotel. The forum will invite academicians, experts, scholars, and executives from renowned domestic and international enterprises in the field of semiconductor ceramic materials to attend and deliver keynote presentations. The forum will focus on advanced ceramic materials used in key semiconductor equipment (such as lithography machines, plasma etching machines, ion implanters, CVD & PVD thin film deposition systems, heat treatment diffusion furnaces, etc.), including high-purity alumina, aluminum nitride, silicon carbide, silicon nitride, yttrium oxide, cordierite, and CVD-SiC. It will also cover key ceramic components such as ceramic heaters, electrostatic chucks, vacuum chucks, focus rings, low-expansion and near-zero-expansion ceramic guide rails, and workpiece stages for lithography machines. The forum will also address technologies for forming, sintering, precision machining, and cleaning of semiconductor-grade ceramics, as well as third-generation silicon carbide semiconductor wafer materials. The forum will facilitate interactive exchanges on new technologies, new processes, new materials, new applications, new markets, and industrial chain development for high-performance semiconductor-grade precision ceramic components, providing valuable opportunities for communication and exchange among upstream and downstream enterprises in the semiconductor ceramic industry. It will discuss the development trends and new opportunities for precision ceramic materials and key components in China's semiconductor industry.

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