Large Diameter Aluminum Nitride Thin Plates | Precision AlN Wafer-Scale Machining
Precision machining of large diameter aluminum nitride (AlN) thin plates. High thermal conductivity, excellent insulation, and superior flatness for semiconductor and electronic applications.
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semiconductor AlN substrate
Product Overview
Large diameter aluminum nitride (AlN) thin plates are precision ceramic components designed for high-performance thermal management and electronic applications. With advanced machining capabilities, these plates achieve large diameters, ultra-thin thickness, and high flatness, making them ideal for semiconductor equipment, electronic substrates, and heat dissipation systems.
Key Features
1. Large Diameter Capability
Supports wafer-scale and oversized ceramic plate manufacturing.
2. Ultra-Thin Processing
Achieves minimal thickness with high structural integrity.
3. High Thermal Conductivity
Efficient heat dissipation for high-power electronic applications.
4. Excellent Electrical Insulation
Suitable for sensitive electronic and semiconductor environments.
5. High Flatness & Precision
Ensures uniform contact and performance in precision assemblies.
Applications
Semiconductor substrates and equipment components
Electronic packaging and heat spreaders
Power electronics thermal management
Vacuum and plasma processing equipment
Precision industrial assemblies
Technical Advantages
Superior heat dissipation performance
Stable mechanical properties in thin structures
Low thermal expansion for dimensional stability
Suitable for cleanroom and high-tech applications
Customization Options
Diameter and thickness (ultra-thin control)
Flatness and parallelism specifications
Surface finishing and polishing
Hole machining or pattern processing
OEM production based on drawings
Localized Title (US)
Large Diameter Aluminum Nitride Thin Plates | Precision Ceramic Machining Supplier in USA
Localized Content Snippet
We provide precision machining of large diameter aluminum nitride thin plates for customers across the United States. Our AlN components offer high thermal conductivity, excellent insulation, and superior flatness for semiconductor and electronic applications.
OEM customization and engineering support available.
🔹 CTA
Request a Custom AlN Plate Quote
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Contact Our Engineering Team
| CategoryGrade | AlN-HT170 | AlN-S170 | |
| Chemical compositionAlN% | % | ≥99.5 | ≥99.5 |
| Chemical structure | |||
| Production Process | Hot Pressing | Atmosphere Sintering | |
| Production Process | |||
| Density | g/cm3 | ≥3.26g/cm3 | ≥3.3g/cm3 |
| Density | |||
| Thermal conductivity (room temperature) | W/m.k | ≥170 | ≥170 |
| Thermal conductivity at 20℃ | |||
| Surface Roughness | um | ≤ 2 | ≤ 2 |
| Surfaceness | |||
| Riedel hardness | HL | 800 | 750 |
| Hardness | |||
| Bending Strength | Mpa | ≥350 | ≥350 |
| Flexural Strength |
