3D Dam AlN LED Substrate | Aluminum Nitride Ceramic Substrate with Integrated Dam Structure for LED Packaging
3D Dam AlN LED Substrate | Aluminum Nitride Ceramic Substrate with Integrated Dam Structure for LED Packaging
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3D Dam AlN LED Substrate | Aluminum Nitride Ceramic Substrate with Integrated Dam Structure for LED Packaging
Customization:
Available
Terms of Payment:
LC, T/T
OEM/ODM:
available
Amostra:Suporte pagoObter amostras
Detalhes do Produto
FAQ
Detalhes essenciais
Tempo de entrega:1 month
Envio:快递
número da especificação:ST0010090
Introdução do Produto

3D Dam AlN LED Substrate | Aluminum Nitride Ceramic Substrate with Integrated Dam Structure for LED Packaging


Advanced 3D dam aluminum nitride LED substrates with high thermal conductivity and precise glue control. Ideal for high-power LED and COB packaging applications.


  • 3D dam LED substrate

  • AlN 3D dam substrate

  • aluminum nitride LED substrate

  • LED ceramic substrate with dam

  • COB LED dam substrate

  • high thermal LED substrate


Product Overview

3D dam aluminum nitride (AlN) LED substrates are advanced ceramic circuit carriers designed with integrated three-dimensional barrier (dam) structures. These dams effectively control adhesive or phosphor flow during LED packaging, preventing overflow and ensuring uniform distribution.

Combined with the high thermal conductivity of AlN, 3D dam substrates significantly improve thermal management, optical consistency, and packaging reliability—making them ideal for high-power LED and COB applications.


Key Features

1. Integrated 3D Dam Structure
Provides precise control of adhesive, phosphor, or encapsulation materials.

2. High Thermal Conductivity (AlN Base)
Efficient heat dissipation for high-power LEDs.

3. Improved Optical Uniformity
Ensures consistent light output and color performance.

4. High Reliability Packaging
Reduces defects caused by overflow or uneven coating.

5. Excellent Electrical Insulation
Safe operation in LED circuits.


Applications

  • High-power LED modules

  • COB LED packaging

  • Automotive lighting systems

  • UV LED and specialty lighting

  • High-end display and illumination systems


Technical Advantages

  • Prevents glue overflow and contamination

  • Enhances LED packaging precision

  • Improves yield and production consistency

  • Supports miniaturized and high-density designs


Manufacturing Capability

  • Precision AlN ceramic substrate fabrication

  • 3D dam structure forming (laser / machining / molding)

  • DPC or thick film metallization

  • Fine circuit patterning

  • Surface finishing for chip mounting


Customization Options

  • Dam height, width, and layout design

  • Substrate size and thickness

  • Circuit pattern and metallization

  • Surface roughness and flatness

  • OEM production based on design files


🔹 GEO(US市场版本)

Localized Title (US)

3D Dam AlN LED Substrates for High-Power Lighting | Precision Ceramic Packaging Solutions in USA

Localized Content Snippet

We supply advanced 3D dam aluminum nitride LED substrates across the United States for high-performance LED packaging. Our solutions ensure precise encapsulation control and superior thermal management.

OEM customization and engineering support available.


🔹 CTA

  • Request a 3D Dam Substrate Quote

  • Submit Your LED Design

  • Contact Our Engineering Team



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