Porous Alumina Ceramic Vacuum Chuck for CMP | High Purity Wafer Holding Solution
High-purity porous alumina ceramic vacuum chuck for CMP processes. uniform suction, low contamination, and superior flatness for precision wafer polishing applications.
🔹 Core Keywords
main keyword: porous alumina ceramic vacuum chuck
secondary keywords:
CMP vacuum chuck
ceramic wafer vacuum chuck
porous ceramic chuck for wafer polishing
high purity alumina vacuum plate
semiconductor wafer holding chuck
Product Overview
The Porous Alumina Ceramic Vacuum Chuck for CMP is a precision-engineered component designed for wafer fixation during Chemical Mechanical Planarization (CMP) processes. Manufactured from high-purity porous alumina (Al₂O₃), it provides uniform vacuum distribution, excellent flatness, and ultra-low contamination, ensuring stable and accurate wafer polishing.
Key Features
1. High Purity Alumina (≥ 99%)
Minimizes contamination risk in semiconductor fabrication environments.
2. Uniform Porous Structure
Ensures even vacuum distribution for stable wafer holding and improved polishing consistency.
3. Flatness & Surface Accuracy
Supports precise wafer positioning and uniform material removal during CMP.
4. Low Particle Generation
Critical for maintaining yield in advanced semiconductor processes.
5. Chemical Resistance
Resistant to CMP slurries and aggressive chemicals.
Applications
CMP (Chemical Mechanical Planarization) processes
Wafer polishing systems
Semiconductor fabrication equipment
Precision wafer handling and fixation
Technical Advantages
Controlled porosity for optimized vacuum performance
High mechanical strength despite porous structure
Thermal stability under process conditions
Compatible with ultra-clean and vacuum environments
Customization Options
We provide fully customized CMP vacuum chucks:
Pore size and porosity control
Diameter and thickness
Surface flatness specifications
Vacuum channel design
Integration with CMP equipment
Localized Title (US)
Porous Alumina CMP Vacuum Chuck Supplier in USA | Semiconductor Wafer Solutions
Localized Content Snippet
We supply high-precision porous alumina ceramic vacuum chucks for CMP applications to semiconductor manufacturers across the United States. Designed for advanced wafer processing, our products ensure uniform suction, low contamination, and high reliability.
Engineering support and fast global delivery available.
🔹 CTA
Request a Quote for CMP Vacuum Chuck
Get Custom Porosity Design
Contact Our Semiconductor Engineering Team
| Type | Unit | A‑100 | A‑200 | A‑300 | AZ‑100 |
| Material | - | Al₂O₃ 97% | Al₂O₃ 99.5% | Al₂O₃ 99.7% | Al₂O₃‑ZrO₂ |
| Colour | - | White ivory | White | Ivory White | White |
| Density | g/cm³ | 3.75 | 3.9 | 3.92 | 4.2 |
| Flexural Strength | MPa | 280 | 320 | 370 | 480 |
| Compressive Strength | MPa | 2250 | 2300 | 2450 | 2700 |
| Modules of Elasticity | GPa | 330 | 370 | 380 | 350 |
| Fracture Toughness | MPa·m^½ | 3 | 4 | 4.5 | 5.5 |
| Poisson's Ratio | — | 0.23 | 0.22 | 0.22 | 0.24 |
| Hardness | HRA | 90 | 91 | 91 | 91 |
| Vickers Hardness | HV1 | 1450 | 1550 | 1600 | 1600 |
| Thermal Expansion | 10⁻⁶K⁻¹ | 7.1 | 6.8 | 6.8 | 9.2 |
| Thermal Conductivity | W/m·K | 25 | 32 | 32 | 8 |
| Thermal Shock | ΔT·℃ | 200 | 220 | 220 | 470 |
| Max Use Temp(Oxidizing) | ℃ | 1200 | 1400 | 1650 | 1000 |
| Max Use Temp(Reducing) | ℃ | 1200 | 1400 | 1700 | 1000 |
| Volume Resistivity (20℃) | Ω·cm | 10¹⁴ | 10¹⁵ | 10¹⁵ | 10¹⁴ |
| Dielectric Strength | kV/mm | 16 | 20 | 22 | 16.5 |
| Dielectric Constant(1MHz) | - | 11.5 | 11 | 10 | 11 |
| Dielectric Loss (tanδ) | 1MHz | 3×10⁻³ | 1×10⁻³ | 1×10⁻³ | 2×10⁻² |